Vincent Auclair will invite Vincent Pateloup, Assistant Lecture at IRCER, to share his testimony on: "The next challenge in additive manufacturing is multi-material 3D printing."
On October 10th, we invite you to be a part of this webinar that explores the promising advances which can be made using multi-material 3D printing, particularly in the electronics sector.
The sector of electrical devices is the most promising of all the application areas. Electric pathways built into ceramic parts represent a disruptive innovation in this field. Ceramic PCBs, LTCC (Low Temperature Cofiring Ceramic), or HTCC (Hot Temperature Cofired Ceramic) can be quickly prototyped using stereolithography (SLA). This method expedites and lowers the cost of developing novel applications.
